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Yampiz SPEC
Package : Surface Mount Device (SMD)
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Axial
Single Inline Package
Dual Inline Package
Diode Outline
Small Outline Diode
Transistor Outline
Small Outline Transistor
Small Outline Package
Enhanced Small Outline Package
Miniature Small Outline Package
Shrink Small Outline Package
Thin Small Outline Package
Thin Shrink Small Outline Package
Very Thin Small Outline No-lead Package
Leadless Chip Carrier
Ceramic Leadless Chip Carrier
Plastic Leaded Chip Carrier
Zig-zag In-line Package
Ball Grid Array
Land Grid Array
Pin Grid Array
Quad Flat No-leads
Quad Flat Package
Dual Flat No-Lead Package
Surface Mount Device
Terminal
X
AXIAL
SIP
DIP
DO
SOD
TO
SOT
SOP
ESOP
MSOP
SSOP
TSOP
TSSOP
VSON
LCC
CLCC
PLCC
ZIP
BGA
LGA
PGA
QFN
QFP
DFN
SMD
CON
EIA-01005
Metric-0402
EIA-0201
Metric-0603
EIA-0402
Metric-1005
EIA-0603
Metric-1608
EIA-0805
Metric-2012
EIA-1206
Metric-3216
EIA-1210
Metric-3225
EIA-1812
Metric-4532
EIA-2010
Metric-5025
EIA-2512
Metric-6432
Cap-Φ63×77
Cap-Φ80×102
Cap-Φ100×102
Cap-Φ100×125
