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Yampiz SPEC
Package : Ceramic Leadless Chip Carrier (CLCC)
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Axial
Single Inline Package
Dual Inline Package
Diode Outline
Small Outline Diode
Transistor Outline
Small Outline Transistor
Small Outline Package
Enhanced Small Outline Package
Miniature Small Outline Package
Shrink Small Outline Package
Thin Small Outline Package
Thin Shrink Small Outline Package
Very Thin Small Outline No-lead Package
Leadless Chip Carrier
Ceramic Leadless Chip Carrier
Plastic Leaded Chip Carrier
Zig-zag In-line Package
Ball Grid Array
Land Grid Array
Pin Grid Array
Quad Flat No-leads
Quad Flat Package
Dual Flat No-Lead Package
Surface Mount Device
Terminal
X
AXIAL
SIP
DIP
DO
SOD
TO
SOT
SOP
ESOP
MSOP
SSOP
TSOP
TSSOP
VSON
LCC
CLCC
PLCC
ZIP
BGA
LGA
PGA
QFN
QFP
DFN
SMD
CON
CLCC-44
